Die Brush & Foam Pad for Wafer-Thin Dies | Graphicint.com


Die Brush & Foam Pad for Wafer-Thin Dies

Product Enquiry

When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.


Product Description

Product Dimensions – Die Brush: 5 1/2″ x 1 3/4″ x 1/4″. Foam Pad: 4 1/2″ x 7 1/4″.
Includes – 1 Die Brush, 1 Foam Pad